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Comparison of Zhangjiang Science City, Hsinchu Science Park, and Yongin Semiconductor Cluster

myinfo3482-1 2025. 5. 26. 15:00

Overview

This table compares Zhangjiang Science City (China), Hsinchu Science Park (Taiwan), and Yongin Semiconductor Cluster (South Korea) across multiple dimensions, including area, key companies, focus areas, characteristics, open innovation platforms, fabless and foundry classifications, order status, revenue scale, infrastructure, talent supply, government support, technology level, global influence, AI cluster integration, energy stability, and geopolitical risks. The analysis informs competitive strategies for Yongin, leveraging the OpenAI Stargate Project to surpass rivals.

 

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Comparison Table

CategoryZhangjiang Science City (AIsland)Hsinchu Science ParkYongin Semiconductor Cluster

Location Shanghai Pudong New Area, Zhangjiang Science City (AIsland: 66,000㎡) Hsinchu City, Taiwan Yongin City, Gyeonggi Province (Cheoin-gu, Idong·Namsa-eup, Wonsam-myeon)
Area 1.5 million ㎡ (expanding from 100,000㎡) ~14.2 km² (14.2 million ㎡) 3.61 million ㎡ (Samsung: 2.35 million ㎡, SK Hynix: 1.26 million ㎡)
Key Companies SMIC, Huawei, Unisoc, Huada Semiconductor, Microsoft, IBM TSMC, UMC, MediaTek, Realtek, Novatek Samsung Electronics, SK Hynix, Dongjin Semichem, Wonik IPS
Focus Areas Semiconductors (foundry, fabless), AI, biotech, pharmaceuticals Semiconductors (foundry, fabless), telecommunications, electronics Semiconductors (memory, foundry), system semiconductors, equipment/materials
Characteristics - AIsland: AI chip testing platform
- Biotech-pharma integration (‘Pharma Valley’)
- 12.07% of China’s IC industry
- State-driven self-reliance (Made in China 2025)
- World’s largest foundry (TSMC) hub
- Strong fabless ecosystem, industry-academia collaboration
- Key global semiconductor supply chain
- Tech tourism (museum)
- Aims for world’s largest single semiconductor cluster
- Memory and system semiconductor focus
- Equipment/materials ecosystem expansion
- GTX-A transport benefits
Open Innovation Platform - Zhangjiang Open Innovation Platform: Connects AI, biotech startups with global firms, patent sharing
- Operated by: Shanghai gov., Huawei, Microsoft
- Outcomes: 2024, 500 startups, 200 joint patents
- Hsinchu Science Park Innovation Hub: TSMC, MediaTek-led open R&D
- Operated by: Taiwan MOST, TSMC-Tsing Hua collaboration
- Outcomes: 2024, 300 fabless collaborations, 150 tech transfers
- Yongin Semiconductor Innovation Platform: Samsung, SK Hynix, fabless linkage
- Operated by: Gyeonggi Province, MOIS, KOSIA
- Outcomes: 2025 target 100 startups, 50 tech collaborations
Fabless (Large/Mid/Small) - Large: Huawei HiSilicon, Unisoc (2)
- Mid: Cambricon, Loongson (~10)
- Small: ~150 (AI, IoT chips)
- Total: ~162
- Large: MediaTek, Novatek (2)
- Mid: Realtek, Himax, MStar (~15)
- Small: ~200 (5G, IoT, automotive)
- Total: ~217
- Large: None
- Mid: Rebellion, Sapion, Telechips (~5)
- Small: ~50 (NPU, ADAS early stage)
- Total: ~55
Foundry (Large/Mid/Small) - Large: SMIC (1, 7nm~14nm)
- Mid: Shanghai Huali, Nexchip (3, 28nm~55nm)
- Small: None
- Total: 4
- Large: TSMC (1, 2nm~16nm)
- Mid: UMC, Vanguard (2, 12nm~130nm)
- Small: None
- Total: 3
- Large: Samsung Electronics (1, 2nm~28nm)
- Mid: SK Hynix (1, planned)
- Small: None
- Total: 2
Order Status - SMIC: Huawei Ascend 910C, Kirin 9010 AI chips
- 2024 revenue growth 20% (sanctions-limited)
- Huali: IoT, automotive chips small-scale
- TSMC: Apple, Nvidia, AMD, Qualcomm large orders
- 2024 3nm yield 80~90%, 4nm 80%+
- UMC: Legacy chip order surge
- Samsung: Nvidia, AMD, Google Tensor chips
- 2024 3nm yield 60~70% (below TSMC)
- SK Hynix: HBM4 order expansion
Revenue Scale - SMIC: ~$8B (2024, global 5th)
- Zhangjiang IC industry: ~$20B
- TSMC: ~$85B (2024, global 1st)
- Hsinchu Park: ~$66B (2023)
- Samsung Foundry: ~$25B (2024)
- SK Hynix: ~$15B (2024)
- Yongin Cluster: $50B by 2035 (projected)
Infrastructure - Power: Shanghai grid, limited renewables
- Water: Adequate, low drought impact
- Data Centers: 5GW UAE-linked, AIsland platform
- Power: Stable, 20% renewable goal
- Water: Drought disruptions (2021, 2023)
- Data Centers: TSMC R&D focus
- Power: KEPCO smart grid, renewable expansion
- Water: 1.072M tons/day by 2034
- Data Centers: Stargate discussions
Talent Supply - Fudan, Shanghai Jiao Tong Univ.
- 50,000 AI/semiconductor MS/PhDs annually
- National Tsing Hua, Yang Ming Chiao Tung Univ.
- 20,000 semiconductor talents annually
- KAIST, Sungkyunkwan, Yonsei Univ.
- 150,000 semiconductor talents by 2032
Government Support - Made in China 2025: $150B fund
- Tax breaks, R&D subsidies
- 17 biomedical cluster linkage
- Science Park Act, tax exemptions, R&D funding
- Talent programs
- TSMC state-backed origin
- Mega Cluster: $360T (Samsung) + $122T (SK)
- Tax breaks, water/power support
- Pangyo Fabless Valley linkage
Technology Level - SMIC: 7nm, 5nm in development
- AI Chips: Ascend 910C (Nvidia A100 rival)
- US sanctions limit equipment
- TSMC: 2nm mass production (2025)
- UMC: 12nm+ legacy focus
- Fabless: 5G, IoT chip leadership
- Samsung: 2nm GAA (2025)
- SK Hynix: HBM4 (2026)
- Fabless: NPU, ADAS early stage
Global Influence - China-centric, 5% global share (SMIC)
- Sanctions limit exports, Huawei focus
- TSMC: 53% global foundry
- Hsinchu: 20% global chip supply
- Fabless: 21% share
- Samsung: 17% foundry, 45% memory
- SK Hynix: 50% HBM share
- Fabless: Minimal share
AI Cluster Integration - AIsland: Huawei Ascend AI chip testing
- DeepSeek collaboration
- UAE Stargate linkage
- TSMC AI R&D, Nvidia partnership
- MediaTek: AIoT, 5G chips
- Japan Stargate priority
- Stargate data center discussions
- Samsung/SK: HBM, AI chip supply
- Rebellion/Sapion: NPU development
Energy Stability - Shanghai grid stable, high coal reliance
- Renewables <15%
- Drought-induced water shortages (2021, 2023)
- 20% renewable goal, stable power
- KEPCO smart grid, renewable growth
- Water: 1.072M tons/day by 2034
Geopolitical Risks - US-China tensions, equipment/tech sanctions
- Hong Kong/Taiwan tensions
- Taiwan Strait tensions, China invasion risk
- High US reliance (Silicon Triangle)
- North-South Korea tensions, neutral in US-China
- US alliance, Taiwan collaboration potential
OpenAI Stargate Linkage - US-China tensions limit participation
- UAE Stargate indirect linkage
- Japan data center priority, indirect Hsinchu link
- TSMC-Nvidia collaboration strengthens
- Samsung/SK investment discussions, Yongin data center likely
- HBM, foundry supply high potential

Competitive Strategies for Yongin Semiconductor Cluster (Stargate Integration)

To surpass Zhangjiang Science City and Hsinchu Science Park, Yongin must leverage the OpenAI Stargate Project with the following strategies:

  1. Stargate Data Center Attraction
    • Strategy: Secure Stargate data center in Yongin, finalize Samsung Electronics and SK Hynix HBM4, 2nm foundry supply contracts.
    • Competitive Advantage: Zhangjiang’s US sanctions limit Stargate participation; Hsinchu is secondary to Japan. Yongin’s stable power grid and semiconductor infrastructure are superior.
    • Execution: Propose Yongin Hwaseong site during Altman’s June 2025 visit, secure 5GW power with KEPCO, integrate startups via Yongin Innovation Platform.
  2. HBM and Foundry Differentiation
    • Strategy: Samsung’s 2nm GAA (2025 mass production) and SK Hynix’s HBM4 (2026) to outpace TSMC (2nm) and SMIC (7nm).
    • Competitive Advantage: Samsung’s 3nm yield (60~70%) needs improvement vs. TSMC (80~90%). HBM 50% global share strengthens Nvidia, AMD orders.
    • Execution: Achieve 75% 3nm yield by late 2025, start SK Hynix HBM4 sampling, collaborate with fabless via Yongin Innovation Platform.
  3. Fabless Ecosystem Expansion
    • Strategy: Support 55 fabless firms (Rebellion, Sapion, FuriosaAI) for NPU development, link with Pangyo Fabless Valley.
    • Competitive Advantage: Hsinchu’s 217 fabless firms (21% share) vs. Yongin’s 55 (early stage). Utilize government’s 1T KRW fabless fund.
    • Execution: Complete Rebellion-Sapion merger by 2025, target 10 fabless firms with 1T KRW revenue by 2032, aim for 100 tech transfers via platform.
  4. Open Innovation Platform Activation
    • Strategy: Develop Yongin Semiconductor Innovation Platform as a global collaboration hub, promote patent sharing and tech transfers among startups, corporations, and universities.
    • Competitive Advantage: Zhangjiang’s platform is China-centric; Hsinchu is TSMC-led. Yongin leverages Samsung/SK global networks and Stargate integration.
    • Execution: Target 200 platform participants, 150 joint patents by 2026. Partner with KAIST for AI chip design open-source initiatives.
  5. Power and Water Infrastructure
    • Strategy: Ensure KEPCO smart grid and MOE water supply (1.072M tons/day by 2034) for data center stability.
    • Competitive Advantage: Hsinchu’s drought (2021, 2023) and Zhangjiang’s coal reliance vs. Korea’s renewable target (30% by 2030).
    • Execution: Build dedicated Yongin data center grid by 2026, expand renewables to 20%.
  6. Government-Private Collaboration and Deregulation
    • Strategy: Link Lee Jae-myung’s 100T KRW AI fund and National AI Computing Center (2T KRW), expand regulatory sandboxes.
    • Competitive Advantage: China’s state-led model faces sanctions; Taiwan’s private-led model lacks scale. Korea balances public-private efforts.
    • Execution: Launch AI fund in late 2025, increase Yongin tax breaks by 30%.
  7. Ethical AI and Global Cooperation
    • Strategy: Develop AI ethics guidelines and data privacy regulations, referencing Botify AI issues.
    • Competitive Advantage: China’s privacy concerns and Taiwan’s regulatory gaps vs. Korea’s transparent AI governance enhance Stargate trust.
    • Execution: Publish FSC AI ethics standards in 2025, strengthen US-Japan AI regulatory ties.
  8. Geopolitical Stability Leverage
    • Strategy: Utilize Korea’s neutral stance in US-China tensions, strengthen US-Taiwan alliances.
    • Competitive Advantage: Zhangjiang faces US sanctions; Hsinchu risks Chinese invasion. Korea’s low North-South tensions and alliances are strengths.
    • Execution: Enhance Korea-US-Japan semiconductor alliance in 2025, sign TSMC collaboration MOU.

Conclusion

Yongin Semiconductor Cluster, with Samsung Electronics, SK Hynix, robust power/water infrastructure, and massive government investment, has strong potential to surpass Zhangjiang Science City and Hsinchu Science Park. Securing Stargate data centers, differentiating HBM/2nm processes, expanding the fabless ecosystem, activating the open innovation platform, and ensuring ethical AI governance are critical to establishing Yongin as a global AI and semiconductor leader.

Sources:

  • ZDNet Korea, “OpenAI meets Lee Jae-myung, accelerates Korea entry,” May 26, 2025
  • Maeil Business, “Yongin mega semiconductor cluster begins water supply design,” May 21, 2025
  • Asia Economy, “Visiting Hsinchu Science Park: Taiwan’s semiconductor path paved by fabless,” June 7, 2024
  • YTN Science, “Hsinchu: Cutting-edge science cluster, largest foundry,” September 11, 2023
  • Opinion News, “Strong in memory, but system, fabless, foundry must grow,” August 16, 2024
  • Newneek, “Semiconductor foundry overview,” May 21, 2025
  • Web: Industry reports and additional search results